Welcome!

Artificial Intelligence Authors: Elizabeth White, Yeshim Deniz, Liz McMillan, Pat Romanski, William Schmarzo

News Feed Item

Ethernet Alliance Breaks New Ground with Successful TeraFabric Plugfest

The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today announced the successful completion of its TeraFabric Plugfest. The groundbreaking plugfest brought together the industry’s largest and most disparate array of Ethernet product and technology vendors in a multi-vendor test environment at the University of New Hampshire InterOperability Laboratory (UNH-IOL). The gains achieved during the TeraFabric Plugfest have allowed the Ethernet ecosystem to move another step closer to realizing the next generation of multi-vendor converged data center networks.

“This is the most diverse interoperability testing event the Ethernet industry has seen to-date in terms of the sheer number of unique vendors, products, and technologies represented, all working in concert to accurately represent the entire spectrum of a converged data center,” said Chauncey Schwartz, chair, Marketing Committee, Ethernet Alliance and senior technical marketing manager, QLogic. “Using an approach incorporating multiple Ethernet speeds, vendors, technologies, and protocols, we were able to successfully construct and transmit data through a 1Tb-capable fabric. Thanks to Ethernet’s continuing maturity and the solid foundation laid during the TeraFabric Plugfest, we’re ready to make the leap into tomorrow’s terabit-enabled future.”

With 18 vendors in attendance, the TeraFabric Plugfest set a new standard for industry-wide cooperation and collaboration. Plugfest participants represented a cross-section of Ethernet switch, storage, adapter, test equipment, and cabling industry leaders, including Amphenol Corporation (NYSE: APH), Applied Micro (NASDAQ: AMCC), Broadcom Corporation (NASDAQ: BRCM), Cisco Systems (NASDAQ: CSCO), CommScope, Inc., Dell Networking and Dell EqualLogic (NASDAQ: DELL), Emulex Corporation (NYSE: ELX), Foxconn International Holdings Ltd. (HKG: 2038), Intel Corporation (NASDAQ: INTC), Ixia (NASDAQ: XXIA), JDS Uniphase Corp (NASDAQ: JDSU), Leviton Manufacturing Co., NetApp Inc. (NASDAQ: NTAP), Nexans S.A. (EN Paris: NEX), Panduit Corp., PLX Technology, Inc. (NASDAQ: PLXT), QLogic Corporation (NASDAQ: QLGC), Samtec, Inc., Siemon Company, TE Connectivity Ltd. (NYSE: TEL), and Volex (LSE: VLX).

Among the notable achievements realized during the event was the successful use of 10GBASE-T in data center bridging (DCB) architectures end-to-end over the maximum length of 100-meters. The event also saw the industry’s first multi-vendor public test of the official IEEE Data Center Bridging Exchange (DCBX) standard 802.1Qaz. In addition, 40GE was successfully tested for the first time in a multi-vendor DCB environment. Cabling vendors also performed thorough signal integrity testing for direct-attach copper cables. Additionally test cases were run using direct-attach passive and active copper cables as well as direct-attach active optical cables. Tests were also completed using 40GbE breakout to four 10GbE copper cables. These cable tests demonstrated the robustness and interoperability between 40GbE implementations, as well as between different rates of Ethernet.

“With the increasing convergence of various technologies onto an Ethernet fabric, the demonstration of Interoperability will be paramount to the success of some of these new and emerging technologies,” said Erica Johnson, director, UNH-IOL. “With over twenty years of Ethernet testing experience, the UNH-IOL was happy to assist the Ethernet Alliance as we seek to foster our vision for a more Interoperable future in an increasingly heterogeneous environment.”

“This was truly a breakout event for the Ethernet Alliance in that it required unprecedented cooperation of vendors from every corner of the Ethernet ecosystem, as well as significant investments of time and resources. The results speak for themselves – not only were we able to achieve our current interoperability testing goals, we’ve laid groundwork for the next evolutionary stage of high-speed converged data center communications,” said John D’Ambrosia, chairman, Ethernet Alliance, chief Ethernet evangelist, CTO office, Dell. “The Ethernet Alliance will continue to actively pursue interoperability events such as the TeraFabric Plugfest in an effort to ensure Ethernet’s global expansion and advancement.”

Additional information about the TeraFabric Plugfest and other Ethernet Alliance interoperability events is available online. A coming white paper with full details and results of the TeraFabric Plugfest will also be made available to all Ethernet Alliance members. For more information about the Ethernet Alliance, please visit http://www.ethernetalliance.org, follow @EthernetAllianc on Twitter, visit its Facebook page, or join the EA LinkedIn group.

About the Ethernet Alliance

The Ethernet Alliance is a global consortium that includes system and component vendors, industry experts and university and government professionals who are committed to the continued success and expansion of Ethernet technology. The Ethernet Alliance takes Ethernet standards to market by supporting activities that span from incubation of new Ethernet technologies to interoperability demonstrations and education.

For more information about the Ethernet Alliance, please visit www.ethernetalliance.org; follow @EthernetAllianc on Twitter; visit the Ethernet Alliance Facebook page; or join the Ethernet Alliance LinkedIn group. Individuals who would like to receive updates on Ethernet Alliance news, activities and events may sign up for the organization’s newsletter at www.ethernetalliance.org/newsletter.

Additional Quotes:

“Amphenol was once again proud to be part of the Ethernet Alliance TeraFabric Plugfest held at UNH’s IOL. These plugfests are a great opportunity to test our cables assemblies and work with the leading Ethernet technology providers in the world. Interoperability is what makes Ethernet flourish and the best way to prove that out is with these plugfests and this was another successful event.” – Greg McSorley, chair, Ethernet Alliance High Speed Modular I/O Subcommittee, and technical business development manager, Amphenol

“By participating in the 10GBASE-T data center bridging portion of the Terabit Plugfest, AppliedMicro was able to demonstrate interoperability, performance and robustness of our 10GBASE-T PHY in an environment with leading suppliers of PHYs, switches, NICs and test equipment. Events such as these offer a clear and objective indication that 10GBASE-T is ready for broad market adoption and this plugfest will help to drive a rapid transition to 10GBASE-T in the data center." – George Jones, vice president of marketing and co-general manager, Connectivity Solutions, Applied Micro Circuits Corporation

"After extensive conversations with our customers, we believe there is a growing need for interoperable ecosystems to build their networks and applications. CommScope's SYSTIMAX® network infrastructure solutions brings 10-, 40-, and 100GbE cabling options to the interoperability test event and helps customers design, deploy and evolve their network infrastructure." – Frank Yang, technical marketing manager, CommScope

"As a principal member of the Ethernet Alliance, Dell is excited to take part in the TeraFabric Plugfest as multivendor interoperability will be critical for wide-spread customer adoption. And proving out key storage and networking converged infrastructure technologies in a multivendor environment validates the overall end-to-end solution.” – Arpit Joshipura, vice president of product management and marketing, Dell Networking

“Ethernet is the backbone of the data center and network convergence provides the path for data center network simplification, with local area network and storage area network traffic able to run on the same wire. The Ethernet Alliance TeraFabric Plugfest allows us to test our current and future technologies in order to ensure interoperability with the Ethernet networking ecosystem for our customers.” – Shaun Walsh, senior vice president of marketing and corporate development, Emulex

“Intel is delighted by the success of the Ethernet Alliance TeraFabric Interoperability Plugfest – the first plugfest with multiple vendors successfully demonstrating 10GBase-T products. The wide variety of vendors, equipment, data rates, physical media and applications – all working together – highlights the value of Ethernet itself, and the strong role that the Ethernet Alliance plays in encouraging an ecosystem of interoperable products. Our customers benefit greatly from this work.” – David Fair, member, Ethernet Alliance Board of Directors, marketing for Storage over Ethernet, Intel

“The plugfest’s high-density network mirrors the challenging environment that many enterprise data centers are moving toward, which require ultra-flexible and massively-scalable test solutions. This event was the first interoperability demonstration of Ixia solutions capable of creating 40GbE converged network conditions, support for 802.1Qaz, and comprehensive coverage of DCB/FCoE and DCB/iSCSI over all media types. Together these solutions enable next-generation data centers to deploy fully optimized and drive the deployment of the latest applications and services.” – Michael Githens, marketing lab program manager, Ixia

“As networking speeds increase, and virtualization becomes more prevalent, the physical layer is becoming a key part of the data center architecture. We are glad that we had the opportunity to participate in the Ethernet Alliance’s TeraFabric Plugfest as it provided us the forum to make sure that Panduit’s optical fiber and copper connectivity solutions interoperate with a wide range of Ethernet switches and servers.” – Jeff Paliga, director of data center solutions, Panduit

“Industry-standard, interoperability initiatives, such as the Ethernet Alliance TeraFabric Plugfest, are critical to advancing Ethernet technology. A principal member of the Ethernet Alliance, QLogic relies on the Ethernet Alliance plugfest and interoperability demonstrations as one way to demonstrate that our Ethernet and converged networking products interoperate with peers in the Ethernet ecosystem. Enterprises reduce the risk and complexity of adopting new Ethernet technology by using products that have been demonstrated to interoperate with a broad range of other products in the Ethernet space.” – Chris Humphrey, vice president of corporate marketing, QLogic

“Samtec is proud to participate in the Ethernet Alliance TeraFabric Plugfest event and is excited to have our Active Optical Cable Assemblies tested to this leading industry specification. Successful Ethernet interoperability testing provides customers with a proven and reliable source for 40 Gbps QSFP+ solutions that break the bandwidth, distance and density limits of traditional copper cabling systems. Ethernet Alliance-tested and approved Active Optical Cable Assemblies are a natural step in the evolution of Samtec’s broad offering of Signal Integrity products and capabilities that allow us to be uniquely positioned to provide our customers with true end-to-end high speed solutions.” – Tom Custer, signal integrity engineer, Samtec

“The Siemon Company participated in this event, as well as previous Ethernet Alliance plugfests to demonstrate our commitment to support the Ethernet ecosystem. Our advanced product line includes high-speed copper and fiber; SFP+ and QSFP+ interconnect assemblies; as well as UTP and shielded twisted pair category 6A and higher 10GBASE-T cabling. We welcome the opportunity to come together with our colleagues in the industry to demonstrate interoperability.” – Randy Below, business development, Siemon Interconnect Solutions, the Siemon Company

"TE Connectivity is pleased to be part of the first Ethernet Alliance TeraFabric Plugfest at UNH-IOL. As a principal member of the Ethernet Alliance, we support its efforts to promote next-generation Ethernet standards and are committed to meeting the industry’s needs through our innovations in high-speed fiber optic components and copper cabling. For participation in this Ethernet Alliance event, TE supplied 40GbE Transceivers, active optical cables, OM3 MPO Cable as well as QSFP+ & SFP+ passive copper cables in various wire gauges and lengths." – Scott Shuey, senior standards engineer, Data Communications Industry, TE Connectivity

“The Ethernet Alliance has once again provided a neutral environment for collaboration and testing by a diverse group of industry leading vendors. Volex is pleased to have participated in the EA TeraFabric Plugfest and to have taken advantage of this unique opportunity to perform interoperability and validation testing of our High-Speed Cables. Volex provided passive copper 10G SFP+, 40G QSFP+, and 40G QSFP+ to four 10G SFP+ hydra link cables for testing side-by-side with others supporting the Ethernet ecosystem. With continued adoption of converged Ethernet in data centers coupled with the ever-increasing need for greater bandwidth, Volex continues to keep pace and fulfill our customer’s needs.” –John Osborne, global vice president, Telecoms/Datacoms Business Sector, Volex

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
SYS-CON Events announced today that Enzu will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Enzu’s mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive ad...
The 21st International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
SYS-CON Events announced today that delaPlex will exhibit at SYS-CON's @CloudExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. delaPlex pioneered Software Development as a Service (SDaaS), which provides scalable resources to build, test, and deploy software. It’s a fast and more reliable way to develop a new product or expand your in-house team.
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
Five years ago development was seen as a dead-end career, now it’s anything but – with an explosion in mobile and IoT initiatives increasing the demand for skilled engineers. But apart from having a ready supply of great coders, what constitutes true ‘DevOps Royalty’? It’ll be the ability to craft resilient architectures, supportability, security everywhere across the software lifecycle. In his keynote at @DevOpsSummit at 20th Cloud Expo, Jeffrey Scheaffer, GM and SVP, Continuous Delivery Busine...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Peak 10, Inc., a national IT infrastructure and cloud services provider, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Peak 10 provides reliable, tailored data center and network services, cloud and managed services. Its solutions are designed to scale and adapt to customers’ changing business needs, enabling them to lower costs, improve performance and focus intern...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs ofte...
DevOps at Cloud Expo – being held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA – announces that its Call for Papers is open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and web-scale businesses, DevOps is expanding to organizations of all sizes, including the world's largest enterprises – and delivering real r...
SYS-CON Events announced today that Linux Academy, the foremost online Linux and cloud training platform and community, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Linux Academy was founded on the belief that providing high-quality, in-depth training should be available at an affordable price. Industry leaders in quality training, provided services, and student certification passes, its goal is to c...
SYS-CON Events announced today that Hitachi Data Systems, a wholly owned subsidiary of Hitachi LTD., will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City. Hitachi Data Systems (HDS) will be featuring the Hitachi Content Platform (HCP) portfolio. This is the industry’s only offering that allows organizations to bring together object storage, file sync and share, cloud storage gateways, and sophisticated search and...
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 21st International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. @ThingsExpo Silicon Valley Call for Papers is now open.
SYS-CON Events announced today that DivvyCloud will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. DivvyCloud software enables organizations to achieve their cloud computing goals by simplifying and automating security, compliance and cost optimization of public and private cloud infrastructure. Using DivvyCloud, customers can leverage programmatic Bots to identify and remediate common cloud problems in rea...
SYS-CON Events announced today that Tintri, Inc, a leading provider of enterprise cloud infrastructure, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Tintri offers an enterprise cloud platform built with public cloud-like web services and RESTful APIs. Organizations use Tintri all-flash storage with scale-out and automation as a foundation for their own clouds – to build agile development environments...
SYS-CON Events announced today that Fusion, a leading provider of cloud services, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Fusion, a leading provider of integrated cloud solutions to small, medium and large businesses, is the industry’s single source for the cloud. Fusion’s advanced, proprietary cloud service platform enables the integration of leading edge solutions in the cloud, including cloud...
SYS-CON Events announced today that Systena America will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Systena Group has been in business for various software development and verification in Japan, US, ASEAN, and China by utilizing the knowledge we gained from all types of device development for various industries including smartphones (Android/iOS), wireless communication, security technology and IoT serv...
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that Carbonite will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Carbonite protects your entire IT footprint with the right level of protection for each workload, ensuring lower costs and dependable solutions with DoubleTake and Evault.