Welcome!

Artificial Intelligence Authors: Carmen Gonzalez, Kevin Jackson, Liz McMillan, Elizabeth White, Shelly Palmer

News Feed Item

Texas Instruments DLP® Technology Set To Deliver Greater In-Car Infotainment With New, Innovative Head-Up Display, Center Console And Dashboard Systems

Range of automotive suppliers and manufacturers showcasing cutting-edge, TI DLP-powered automotive/vehicle display systems throughout CES 2013

LAS VEGAS, Jan. 7, 2013 /PRNewswire/ -- Today at the International Consumer Electronics Show (CES), Texas Instruments (TI) (NASDAQ: TXN) DLP® Products, to carry on TI's longstanding commitment to the automotive industry, has revealed its latest vision for the future of in-car/vehicle infotainment with groundbreaking augmented reality (AR) head-up displays (HUD), digital dashboards, and center console systems enabled by TI DLP technology. These next-generation systems from TI mark TI DLP's first official entry into the automotive industry, and represent a notable shift forward with regards to higher resolution and brightness, expanded field of view, tactile feedback, distraction-reduced functionality, and interior design flexibility that breaks the design barriers of existing technology. Together with a number of automotive suppliers and manufacturers, TI will be demoing some of the new-era systems across the show floor during CES 2013 to offer a glimpse of what drivers and passengers can possibly experience in their cars in as little as a few years.  

To view the multimedia assets associated with this release, please click http://www.prnewswire.com/news-releases/texas-instruments-dlp-technology-set-to-deliver-greater-in-car-infotainment-with-new-innovative-head-up-display-center-console-and-dashboard-systems-185819001.html

Further supporting TI DLP's expansion into the automotive space, Strategy Analytics noted in its automotive electronics report* that through 2018, "High growth application areas (with unit CAAGRs in excess of 50%) include: Pure electric vehicles, head-up displays, drowsiness detection, front LED lighting, stop/start, lane departure warning, and blind spot monitoring."

"DLP technology has long been known as a leader in digital image quality and intelligent display capabilities across a variety of products and applications," said Kent Novak, senior vice president and general manager, Texas Instruments DLP Products. "For us, the world of in-vehicle infotainment, especially augmented reality head-up displays in the near future, can benefit greatly from what we can do with DLP technology, combined with TI's proven automotive processors, sensors and other products. With our partners, we're delivering the same connected, immersive experiences that consumers expect from smartphones, tablets, gaming systems, and more into the cabins of modern cars and vehicles, but in a less distracting and more usable way."

With the unique micromirror structure of DLP technology, TI has been able to develop a compact HUD system with higher brightness and clarity amid driving conditions, a much wider field of view and increased color reproduction over other display types. Software-based augmented reality elements, such as navigational indicators, real-time landmark details, or safety warnings, can be shown in relation to real-world objects in view to help keep the driver focused on the road ahead. Additionally, the size of the HUD image can also be adjusted and positioned on the windshield to best match the line of vision depending on their seating position, and thus improve the driver's ability to stay focused and alert.

For console and dashboard displays, the speed and accuracy of DLP technology, combined with infrared cameras and other TI components, such as the new "Jacinto 6" processor, allow for multipoint, touchscreen interactivity across the entire surface of the console, scalability to any size and shape, including curves, and true tactile comfort and familiarity via integration of physical dials and buttons. Additionally, full-color, high resolution video, animations, and static images to indicate vehicle information, navigation, in-car entertainment, and HVAC controls can be shown simultaneously and even repositioned to best suit the driver and passengers. Additional TI sensors can determine whether it is the driver's or a passenger's hands approaching the console and adjust the images and available functions accordingly for safety.

All DLP-powered HUD, dashboard, and console setups will be able to display content from whatever software programs and formats that manufacturers may choose, whether proprietary or 3rd party commercial/open source.

To experience all of these automotive displays firsthand, along with other new and upcoming products and advancements made possible with TI DLP technology, be sure to check us out at the following CES 2013 events, and visit our partners' exhibits throughout the show floor:

To access the latest news, videos, images and other digital content from TI DLP during CES, please visit our online press page at DLP.com/CES2013. You can also follow us on Twitter at @TI_DLP, and on YouTube at YouTube.com/DLPTechnology. For the latest on other applications for DLP technology overall, please visit DLP.com.

Not attending CES? Stay connected with TI:

*From Strategy Analytics' August 2011 report "Automotive Electronics system Demand Forecast 2009 to 2018," page 4

About Texas Instruments DLP Products
Since 1996, Texas Instruments' award-winning DLP technology has powered the world's top display devices to deliver higher resolution images rich with color, contrast, clarity and brightness for a wide range of applications, including intelligent display technology. With DLP's intelligent display capability, users can interact with content in a diverse range of applications, such as automotive, medical and interactive projection. DLP's technology spans movie theaters (DLP Cinema®) and large-scale, professional venues; in conference rooms, classrooms, and home theaters; and with DLP Pico™-enabled mobile devices, the ability to display images from the palm of your hand. Every DLP chip features an array of up to 8 million microscopic mirrors that switch at ultra-high speeds. With this speed advantage, DLP enables applications unheard of by competing display technologies. To learn more about DLP technology, please visit www.DLP.com, or follow DLP on Twitter at www.Twitter.com/TI_DLP.

About Innovation at TI
For more than 80 years, TI has been at the forefront of technical innovation, enabling customers to differentiate products with higher integration, faster speeds and lower power. Today, we are engineering the future with advances in energy harvesting, power management, cloud computing, safety and security, health technology, and more. Learn more about how TI's Analog and Embedded Processing products are improving how we live, work and play, today and well into the future, at www.ti.com/innovation.

About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.

Related Link
Texas Instruments DLP's CES 2013 press page

SOURCE Texas Instruments DLP

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Hitachi, the leading provider the Internet of Things and Digital Transformation, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Hitachi Data Systems, a wholly owned subsidiary of Hitachi, Ltd., offers an integrated portfolio of services and solutions that enable digital transformation through enhanced data management, governance, mobility and analytics. We help globa...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place June 6-8, 2017, at the Javits Center in New York City, New York, is co-located with 20th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry p...
NHK, Japan Broadcasting, will feature the upcoming @ThingsExpo Silicon Valley in a special 'Internet of Things' and smart technology documentary that will be filmed on the expo floor between November 3 to 5, 2015, in Santa Clara. NHK is the sole public TV network in Japan equivalent to the BBC in the UK and the largest in Asia with many award-winning science and technology programs. Japanese TV is producing a documentary about IoT and Smart technology and will be covering @ThingsExpo Silicon Val...
NHK, Japan Broadcasting, will feature the upcoming @ThingsExpo Silicon Valley in a special 'Internet of Things' and smart technology documentary that will be filmed on the expo floor between November 3 to 5, 2015, in Santa Clara. NHK is the sole public TV network in Japan equivalent to the BBC in the UK and the largest in Asia with many award-winning science and technology programs. Japanese TV is producing a documentary about IoT and Smart technology and will be covering @ThingsExpo Silicon Val...
20th Cloud Expo, taking place June 6-8, 2017, at the Javits Center in New York City, NY, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy.
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
Most technology leaders, contemporary and from the hardware era, are reshaping their businesses to do software in the hope of capturing value in IoT. Although IoT is relatively new in the market, it has already gone through many promotional terms such as IoE, IoX, SDX, Edge/Fog, Mist Compute, etc. Ultimately, irrespective of the name, it is about deriving value from independent software assets participating in an ecosystem as one comprehensive solution.
SYS-CON Events announced today that Hitachi Data Systems, a wholly owned subsidiary of Hitachi LTD., will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City. Hitachi Data Systems (HDS) will be featuring the Hitachi Content Platform (HCP) portfolio. This is the industry’s only offering that allows organizations to bring together object storage, file sync and share, cloud storage gateways, and sophisticated search an...
SYS-CON Events announced today that Hitachi, the leading provider the Internet of Things and Digital Transformation, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Hitachi Data Systems, a wholly owned subsidiary of Hitachi, Ltd., offers an integrated portfolio of services and solutions that enable digital transformation through enhanced data management, governance, mobility and analytics. We help globa...
Five years ago development was seen as a dead-end career, now it’s anything but – with an explosion in mobile and IoT initiatives increasing the demand for skilled engineers. But apart from having a ready supply of great coders, what constitutes true ‘DevOps Royalty’? It’ll be the ability to craft resilient architectures, supportability, security everywhere across the software lifecycle. In his keynote at @DevOpsSummit at 20th Cloud Expo, Jeffrey Scheaffer, GM and SVP, Continuous Delivery Busine...
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
SYS-CON Events announced today that CollabNet, a global leader in enterprise software development, release automation and DevOps solutions, will be a Bronze Sponsor of SYS-CON's 20th International Cloud Expo®, taking place from June 6-8, 2017, at the Javits Center in New York City, NY. CollabNet offers a broad range of solutions with the mission of helping modern organizations deliver quality software at speed. The company’s latest innovation, the DevOps Lifecycle Manager (DLM), supports Value S...
SYS-CON Events announced today that Super Micro Computer, Inc., a global leader in compute, storage and networking technologies, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Supermicro (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/...
Amazon has gradually rolled out parts of its IoT offerings in the last year, but these are just the tip of the iceberg. In addition to optimizing their back-end AWS offerings, Amazon is laying the ground work to be a major force in IoT – especially in the connected home and office. Amazon is extending its reach by building on its dominant Cloud IoT platform, its Dash Button strategy, recently announced Replenishment Services, the Echo/Alexa voice recognition control platform, the 6-7 strategic...
@GonzalezCarmen has been ranked the Number One Influencer and @ThingsExpo has been named the Number One Brand in the “M2M 2016: Top 100 Influencers and Brands” by Analytic. Onalytica analyzed tweets over the last 6 months mentioning the keywords M2M OR “Machine to Machine.” They then identified the top 100 most influential brands and individuals leading the discussion on Twitter.
SYS-CON Events announced today that Juniper Networks (NYSE: JNPR), an industry leader in automated, scalable and secure networks, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Juniper Networks challenges the status quo with products, solutions and services that transform the economics of networking. The company co-innovates with customers and partners to deliver automated, scalable and secure network...
The age of Digital Disruption is evolving into the next era – Digital Cohesion, an age in which applications securely self-assemble and deliver predictive services that continuously adapt to user behavior. Information from devices, sensors and applications around us will drive services seamlessly across mobile and fixed devices/infrastructure. This evolution is happening now in software defined services and secure networking. Four key drivers – Performance, Economics, Interoperability and Trust ...
Data is an unusual currency; it is not restricted by the same transactional limitations as money or people. In fact, the more that you leverage your data across multiple business use cases, the more valuable it becomes to the organization. And the same can be said about the organization’s analytics. In his session at 19th Cloud Expo, Bill Schmarzo, CTO for the Big Data Practice at Dell EMC, introduced a methodology for capturing, enriching and sharing data (and analytics) across the organization...